02:48 ETLinktel, Founding Member of XPO MSA, to Debut 12.8T Liquid-Cooled Module at OFC 2026
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Linktel Technologies has announced the debut of its 12.8T XPO liquid-cooled optical module at OFC 2026. This module is designed to meet the increasing density and thermal demands of next-generation data centers, achieving a front-panel density of 204.8 Tbps per rack unit. It features advanced thermal management and is compatible with various standards. Linktel aims to lead the development of new standards for AI workloads, showcasing its commitment to high-performance optical solutions. The demonstration will take place at Booth #1219 during the event.
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