The original design manufacturing (ODM) platform for smart products, Huaqin Technology (3296.HK), will be open for subscription from April 15 to 20. As of yesterday (15th) at 3 PM, Huaqin Technology has received margin financing of HKD 360 million, which is still insufficient compared to the public offering fundraising amount of HKD 460 million.
Huaqin Technology plans to issue 58.548 million H shares, with 10% available for public offering in Hong Kong. The offering price will not exceed HKD 77.7 per share, raising a maximum of HKD 4.55 billion. Each lot consists of 100 shares, with an entry fee of HKD 7,848.4. Huaqin Technology's H shares are expected to be listed for trading on April 23, with China International Capital Corporation and Bank of America Securities as joint sponsors.
<h2>Background</h2>
Huaqin Technology Co., Ltd. is a platform company deeply engaged in the smart product field, integrating core technologies such as artificial intelligence, the Internet of Things, big data, and communication technology, while incorporating multiple smart functions. The group's business is rooted in three major pillar products: smartphones, laptops, and servers. The group promotes the development and application of products and technologies in the era of mobile communication, the Internet, cloud computing, and artificial intelligence, providing smart products covering mobile terminals, computing and data center businesses, AIoT, and innovative business areas for global technology companies.
More information:【New Stock IPO】Smart Product ODM Platform Huaqin Technology 3296 IPO Annual Revenue of Hundreds of Billions Attracts Investment from Morgan Stanley, Xiaomi, etc., Entry Fee HKD 7,848.4, Will You Subscribe?

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Huaqin Technology will conduct an IPO from April 15 to 20. As of 3 PM on the 15th, it has received margin financing of HKD 360 million, but has not been fully subscribed. The company plans to issue 58.548 million H shares, with a public offering fundraising amount of HKD 460 million, and the offering price will not exceed HKD 77.7 per share, with listing expected on April 23. Huaqin Technology focuses on the field of smart products, covering technologies such as artificial intelligence and the Internet of Things

Tasty Money

Huaqin

CICC

Bank of America

JPMorgan Chase

XIAOMI-W

BANK OF AMERICA CORPORATION DEP SHS REP 1/1000TH INT NON CUM PFD QQ

BANK OF AMERICA CORPORATION DEP SHS REP 1/1200TH PRF SERIES '5'

BANK OF AMERICA CORPORATION 7.25% NON-CUM PERP CONV PFD SER L

BANK OF AMERICA CORPORATION 5.875%NON CUM DEP SHS REP1/1000TH SER HH

BANK OF AMERICA CORPORATION DEP SHS REP 1/1200TH PRF SERIES '2'

BANK OF AMERICA CORPORATION 5% DEP SHS REPR 1/1000TH NON CUM PFD LL

BANK OF AMERICA CORPORATION DEP SHARES REP 1/1000TH PERP PFD SER 'E'

BANK OF AMERICA CORPORATION INCOME CAPITAL OBLIG NTS DUE 15/12/2066

BANK OF AMERICA CORPORATION 4.375% DP SH RP 1/1000TH IN NON CU PF NN

BANK OF AMERICA CORPORATION DEP SH REP 1/1200TH PRF SER 1 USD25

BANK OF AMERICA CORPORATION 5.375%DEP SHS REP 1/1000TH NON CUM SR KK

BANK OF AMERICA CORPORATION 6%NON CUM DEP SHS EACH REP 1/1000 SER GG

BANK OF AMERICA CORPORATION DEP SHS REP 1/1200 PFD SER 4 USD25

BANK OF AMERICA CORPORATION DEP SHS REP 1/1000TH NON CUM PFD SER SS

BANK OF AMERICA CORPORATION 4.125%DEP SH REP 1/1000 PFD SER PP USD25

Bank of America Corp

JPMORGAN CHASE & CO. 4.20% DEP SHS REPSTG 1/400TH PFD SER MM

JPMORGAN CHASE & CO. 6%NON CUM DEP SHS REP 1/400TH PFD SER EE

JPMORGAN CHASE & CO. DEP REP 1/400TH (5.75% NON CUM PFD DD)

JPMORGAN CHASE & CO. 4.625% DEP SH RE 1/400TH INT NO CU PF LL

JPMorgan Chase & Co.

JPMORGAN CHASE & CO. 4.55% DEP SHS REPSTG 1/400TH PFD SER JJ

JPMORGAN CHASE & CO. 4.75 DEP SHS REP 1/400 NCUM PFD SR GG

Xiaomi Corporation

XIAOMI-WR

Xiaomi HK SDR 2to1

【New Stock IPO】【Subscription Situation】【Continuously Updated】ODM platform Huaqin Technology (3296) has borrowed HKD 360 million in margin financing, and has not yet been fully subscribed