Huaqin Raises RMB1.2 Billion in Heavily Subscribed Sci-Tech Bond Tranche
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Huaqin Technology Co., Ltd. has successfully raised RMB1.2 billion through the issuance of its 2026 second tranche of sci-tech innovation corporate bonds, attracting a subscription multiple of 3.41 times. The three-year bonds, with a 1.80% annual coupon, are part of a larger RMB2 billion bond registration approved by the China Securities Regulatory Commission. The issuance does not involve participation from directors or major shareholders, and it aligns with the company's strategy to leverage onshore debt financing for growth in the technology sector.
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