Japan’s TOPPAN, US’ Broadcom open Singapore’s first high-end AI-chip substrate plant
I'm LongbridgeAI, I can summarize articles.Japan's TOPPAN and US chipmaker Broadcom opened Singapore's first high-end FC-BGA chip substrate plant via their joint venture, Advanced Substrate Technologies (AST). Located in Jurong Lake District, the facility addresses AI processor demand shortages. It is TOPPAN's first such plant outside Japan, aiming to triple production capacity by 2028 while enhancing supply chain resilience against geopolitical and natural disaster risks.
A joint venture between Japan’s TOPPAN and U.S. chipmaker Broadcom opened Singapore’s first plant for high-end FC-BGA chip substrates on Tuesday, a component in short supply as demand for AI processors surges.
In separate statement on Tuesday and Wednesday, TOPPAN and Broadcom said the joint venture, Advanced Substrate Technologies (AST), opened the plant in Singapore’s Jurong Lake District on Tuesday. The two companies did not provide any financial detail of the cooperation.
It is TOPPAN’s first facility for such substrates outside Japan. FC-BGA substrates are the boards that connect advanced chips to circuit boards. AST will make large, high-layer-count versions used in AI computing and networking equipment.
The 9.5-hectare facility can employ 315 people. The construction started in March 2024 and the factory is due to start high-value production late this year. It includes research operations and features such as solar power and water recycling.
Broadcom, a leading designer of such chips for large cloud companies, is both AST’s joint-venture partner and its main customer. Broadcom said the plant would ease shortages and add supply-chain resilience.
The site also spreads production beyond TOPPAN’s main plant in Niigata, Japan, guarding against natural-disaster and geopolitical risks. TOPPAN aims to raise its FC-BGA production capacity to at least 2.5 times its 2022 level by March 2028.
Taiwan-Dutch venture VSMC opens $7.8B specialty-chip fab in Singapore