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Report: Taiwan Semiconductor Manufacturing Company Ltd. Speeds Up Expansion of 2nm Chip Capacity, Monthly Capacity to Sprint to 120,000 Wafers by Year-end

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TSMC is accelerating its 2nm chip capacity expansion, driven by strong demand from Apple and other clients. Monthly production is projected to reach 120,000 wafers by year-end, surpassing initial estimates of 90,000-100,000. This pace allows TSMC to achieve its 2027 target ahead of schedule, outpacing the ramp-up speed of its previous 3nm generation.

Taiwan Economic Daily, citing sources, reported that Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) is accelerating the expansion of its 2-nanometer chip production capacity, with progress exceeding expectations.

It is understood that, in response to strong demand from Apple Inc. (AAPL.US) and non-Apple customers, the rollout speed and scale of new capacity for TSMC's overall 2-nanometer family have both set new records, far surpassing the first-year capacity ramp-up pace of the 3-nanometer family.

The market had originally expected monthly production capacity for TSMC's 2-nanometer family to reach about 90,000 to 100,000 wafers by the end of this year, with continued double-digit growth in 2027 to 110,000 to 140,000 wafers. Industry sources said that due to strong additional orders from customers, TSMC is accelerating the expansion of 2-nanometer family capacity, with monthly capacity set to sprint to 120,000 wafers by the end of this year, meaning the original 2027 target will be achieved ahead of schedule. (jl/u)(Real-time Streaming US Stocks Quote; Except All OTC quotes are at least 15 minutes delayed.)

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