Chipmore

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program development, probe card/POGO PIN design and repair, and thin film flip chip tape design. Its packaging and testing products include various display driver chips, power management chips, and RF front-end chips used for applications in televisions, smartphones, automotive electronics, ablets, laptops, HDTVs, smart wearables, electronic communications, and industrial control.