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Closed: Oct 9, 16:00:00 (EDT)GlobalFoundries and TSMC sign $2B AI packaging deal
TechNode·- GlobalFoundries and TSMC have signed a $2 billion, five-year manufacturing agreement to establish a US supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem. - Under this pact, GlobalFoundries will expand capacity at its New York facility to supply interposers, with volume production expected to ramp in the first half of 2028. - This partnership aims to strengthen the AI hardware supply chain by extending crucial advanced packaging capabilities to the United States while supporting growing computing demands.GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging | GFS Stock News
StockTitan·- GlobalFoundries and TSMC reached a multi-year $2 billion agreement to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem. - Under this 5-year agreement, GlobalFoundries will expand fabrication capacity at its Malta, New York facility to support growing demand for artificial intelligence and high-performance computing technologies. - Volume production is expected to begin ramping in the first half of 2028, providing greater scale and flexibility for advanced packaging solutions.SG Semiconductor launched amidst global chip push
Singapore Business Review·