JCET(600584.SH)

JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit back-end and technology services in China, South Korea, the United States, and internationally. The company offers turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments; design solutions; and characterization services, such as mold flow, mechanical, and electrical analysis, as well as thermal analysis test. It also provides packaging solutions comprising wirebond, flip chip, wafer level, power device, and MEMS and sensors packaging, as well as wafer bumping, system-in-package, and advancement of mainstream package; and testing solutions, which include test platform, wafer sort, test development, and ITMS, as well as RF, mixed-signal, memory/3D, digital, strip, post, and final tests. In addition, the company is involved in sewage treatment; investment activities; and trading.