Joe Parks, formerly of $Intel(INTC.US) and currently CTO at $TPRO does a great job of explaining the motivation for Chiplets and Die Disaggregation in this CMD presentation (38:45-53:00)
What Joe dives into is a lesser appreciated implication of #Chiplets; namely a sharp increase in demand for greater test intensity.#Advantest $Teradyne(TER.US) $Formfactor(FORM.US) $TPRO #AccretechSource: Chips & Wafers