UMC, Taiwan’s 2nd biggest chip foundry, is looking to expand a fab in south Taiwan due to an overflow of advanced packaging and specialty AI-related orders (silicon interposers, DTC) from Qualcomm, Intel and SanDisk, media report, noting new plans for UMC’s Fab 12A P7 near Tainan, Taiwan, are under evaluation. Orders for power management chips (PMICs) for AI products are also booming.
UMC is working with Qualcomm on silicon interposers, DTC (deep trench capacitors), and wafer-to wafer hybrid bonding, while Intel and UMC have partnered on 12nm FinFET, and the UMC-SanDisk cooperation is for memory chip stacking. The story cites unnamed industry sources. $United Microelectronics(UMC.US) $Qualcomm(QCOM.US) $Sandisk(SNDK.US) $Intel(INTC.US) #semiconductorsSource: Dan Nystedt
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