Semiconductors

CHIPPACKING

CHIPPACKING released FY2026 Q1 earnings on April 27 After-Market (BJT), actual revenue CNY 223.44 M, actual EPS CNY -0.03

CHIPPACKING to Release FY2026 Q1 Earnings on April 28 After-Market (BJT)

CHIPPACKING to release FY2025 earnings on March 17, pre-market (BJT), forecast revenue CNY 731.67 M, EPS CNY 0.09

CHIPPACKING released FY2025 Q4 earnings on February 27 Pre-Market (BJT), actual revenue CNY 238.24 M, actual EPS CNY 0.0122

CHIPPACKING released FY2025 earnings on February 27 Pre-Market (BJT), actual revenue CNY 768.79 M (forecast CNY 731.67 M), actual EPS CNY -0.71 (forecast CNY 0.09)

CHIPPACKING to Release FY2025 Q3 Earnings on October 31 During-Market BJT

CHIPPACKING released FY2025 Q3 earnings on October 15 During-Market (BJT), actual revenue CNY 204.64 M, actual EPS CNY -0.1696

CHIPPACKING released FY2025 9 Months Earnings on October 15 During-Market BJT, actual revenue CNY 530.55 M, actual EPS CNY -0.7193

CHIPPACKING released FY2025 Q2 earnings on August 11 During-Market (BJT), actual revenue CNY 194.29 M, actual EPS CNY -0.2497

CHIPPACKING released FY2025 Semi-Annual Earnings on August 11 During-Market (BJT), actual revenue CNY 325.91 M, actual EPS CNY -0.55

CHIPPACKING to Release FY2025 Semi-Annual Earnings on August 12, 2025 (BJT)

Giant Power Sci & Tech Progress in GaN Chip Packaging Project and Shareholder Numbers Released

Q1 2025 Kippa Technology Announces Earnings Report

CHIPPACKING released FY2025 Q1 earnings on April 25 After-Market BJT, actual revenue CNY 131.62 M, actual EPS CNY -0.3

CHIPPACKING to Release FY2025 Q1 Earnings on April 26 After-Market BJT

CHIPPACKING to Release FY2024 Earnings on April 26, 2025 (BJT), Forecast Revenue CNY 609.73 M, EPS CNY -0.82

CHIPPACKING released FY2024 annual earnings on February 27 (BJT), actual revenue CNY 666.56 M (forecast CNY 609.73 M), actual EPS CNY -0.96 (forecast CNY -0.82)

CHIPPACKING released FY2024 Q4 earnings on February 27, 2025 (BJT) with actual revenue of CNY 171.11 M and EPS of CNY -0.3927

Qipai Technology Expects Revenue of 673 Million Yuan in 2024, Up 21.42%

CHIPPACKING released FY2024 9 Months Earnings on October 28 After-Market (BJT), actual revenue CNY 495.45 M, actual EPS CNY -0.5702

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CPO and other computing hardware stocks opened strong, with YOFC hitting the daily limit, T&S rising over 14%, and EverProX, HTGD, ZTT, and FiberHome among the top gainers. Semiconductor chip stocks continued to strengthen, with CHIPPACKING, CMS, Nations rising over 10%, and Fine Made, SM Micro, JIANGSU JIEJIE MICROELECTRONICS, Novosense, and SG Micro seeing gains of over 7%

- The A-share market saw a mixed performance, with increases in semiconductor and CPO stocks, while gold prices surged due to geopolitical tensions and a declining dollar.  
- The Hang Seng Index rose by over 1%, reaching a new high since 2021, driven by gains in tech stocks and strong performances in the gold and colored metals sectors.  
- Corning's significant contract with Meta for fiber cables supports the growth of AI data centers and reflects ongoing demand from major tech companies.

Wallstreetcn

NSING TECH

Fullgoal SSE Composite ETF

Fine Made

HTGD

Hang Seng Index

EverProX

SM Micro

Zijin Mining

SSE Index

FiberHome

China Southern Hang Seng ETF

Guotai SSE Composite ETF

SG Micro

ZHONGJIN GOLD

Abrdn Gold ETF Trust

Yinhua MSCI China A ETF

ChinaAMC Gold ETF

Pro Ultr GLD

Invesco Db Precious Metals ETF

JIANGSU JIEJIE MICROELECTRONICS

SPDR Gold Shares

Abrdn Precious Metals Basket ETF Trust

Tianhong CSI Computer Theme ETF

YOFC

SD-GOLD

Meta Platforms

Novosense

ChinaAMC CSI SH-SZ-HK Gold Industry Equity ETF

The Shanghai Composite Index fluctuated and rose, "Meta concept stocks" surged, the gold and silver sector saw widespread limit-ups, the Hang Seng Index rose over 1% to reach a nearly five-year high, and tech stocks rebounded

Semiconductor chip stocks continue to strengthen, with CHIPPACKING, CMS, and Nations rising over 10%, while Fine Made, SM Micro, JIANGSU JIEJIE MICROELECTRONICS, Novosense, and SG Micro among others rising over 7%

CHIPPACKING announced that it recently received a notice of acceptance issued by the Shanghai Stock Exchange. The Shanghai Stock Exchange has verified the application documents submitted by the company for the issuance of shares to specific targets, and believes that the documents are complete and comply with legal forms. It has decided to accept the application and will conduct a legal review. This issuance still requires approval from the Shanghai Stock Exchange and registration approval from the China Securities Regulatory Commission before it can be implemented. There is uncertainty regarding whether it will pass the review and the time for obtaining approval. The company will disclose progress in a timely manner as required and remind investors to pay attention to risks

Zhitong

CHIPPACKING: The application for the issuance of A-shares to specific targets in 2025 has been accepted by the Shanghai Stock Exchange

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The integrated circuit packaging and testing sector surged, with Chipmore rising over 10%, followed by FHEC, V-Test, CHIPPACKING, UNION SEMICONDUCTOR (HEFEI), and WLCSP

Chipmore

FHEC

V-Test

UNION SEMICONDUCTOR (HEFEI)

WLCSP

The integrated circuit packaging and testing sector surged sharply, with Chipmore rising over 10%

CHIPPACKING plans to issue A-shares to specific investors controlled by actual controllers, raising no more than 159 million yuan. The issuers include Liang Dazhong, Bai Ying, and Liang Huate, all of whom are related parties of the company, and this issuance constitutes a related party transaction. The raised funds will be used to supplement working capital

CHIPPACKING plans to raise no more than 159 million yuan through a private placement to its actual controller

CHIPPACKING released its semi-annual performance for 2025, with revenue of 326 million yuan, a year-on-year increase of 4.09%. The net loss attributable to the parent company was 58.67 million yuan, with a non-recurring net profit loss of 66.07 million yuan, and basic earnings per share of -0.55 yuan. The performance change was mainly due to increased depreciation of buildings caused by the solidification of Phase II infrastructure and the capitalization of loan interest expenses, while the value-added tax deduction amount for integrated circuit companies decreased

CHIPPACKING released its semi-annual performance, with a net loss attributable to the parent company of 58.67 million yuan

CHIPPACKING announced that its operating revenue in the first half of 2025 is 326 million yuan, a year-on-year increase of 4.09%. The net loss attributable to shareholders of the listed company is 58.6686 million yuan, compared to a net loss of 40.5957 million yuan in the same period last year

CHIPPACKING: Net loss of 58.6686 million yuan in the first half of 2025

On the evening of August 4th, CHIPPACKING announced that the board of directors agreed to elect Liang Dazhong as the chairman of the fifth board of directors, agreed to appoint Liang Dazhong as the general manager of the company, appointed Rao Xilin, Wen Zhengguo, and Wang Yangbao as vice general managers of the company, appointed Wen Zhengguo as the board secretary, and appointed Li Zewei as the financial director, with terms consistent with the current board of directors' term

CHIPPACKING: Liang Dazhong serves as the chairman of the company

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The semiconductor sector strengthened at the beginning of the trading session, with ACETRON hitting the daily limit, followed by gains in JSZY, ASR, LION, MACMIC, CHIPPACKING, and Dongxin Technology

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LION

MACMIC

ACETRON

The semiconductor sector strengthened at the beginning of the trading session, and ACETRON hit the daily limit up during the session

CHIPPACKING(688216.SH)