Semiconductors

Chipmore

Chipmore released FY2026 Q1 earnings on April 19 After-Market (BJT), actual revenue CNY 420.37 M, actual EPS CNY -0.25

Chipmore to Release FY2026 Q1 Earnings on April 20 After-Market (BJT)

Chipmore FY2025 Earnings Release on April 20 During-Market BJT

Chipmore released FY2025 Q4 earnings on February 26 During-Market (BJT), actual revenue CNY 585.66 M, actual EPS CNY 0.0592

Chipmore released FY2025 earnings on February 26 During-Market (BJT), actual revenue CNY 2.19 B, actual EPS CNY 0.22

Chipmore to Release FY2025 Q3 Earnings on October 30 After-Market BJT

Chipmore released FY2025 9 Months earnings on October 15 After-Market (BJT), actual revenue CNY 1.605 B, actual EPS CNY 0.1762

Chipmore released FY2025 Q3 earnings on October 15 After-Market (BJT), actual revenue CNY 608.84 M, actual EPS CNY 0.087

Chipmore released FY2025 Q2 earnings on August 21 After-Market (BJT), actual revenue CNY 521.45 M, actual EPS CNY 0.0692

Chipmore released FY2025 Semi-Annual earnings on August 21 After-Market BJT, actual revenue CNY 995.76 M, actual EPS CNY 0.08

Chipmore FY2025 Semi-Annual Earnings Release on August 22, 2025 (BJT)

Qizhong Technology Repurchasing A-shares

Chipmore released FY2025 Q1 earnings on April 29 During-Market BJT, actual revenue CNY 474.31 M, actual EPS CNY 0.02

Chipmore FY2025 Q1 Earnings Release on April 30 During-Market BJT

Chipmore FY2024 Annual Earnings Release on April 1, 2025 (BJT)

Chipmore released FY2024 Q4 earnings on February 26 (BJT), with actual revenue of 524.07 M CNY and EPS of 0.0699 CNY

Chipmore released FY2024 annual earnings on February 26 (BJT), with actual revenue of 1.959 B CNY and EPS of 0.26 CNY

Chipmore released FY2024 9 Months Earnings on October 16 After-Market (BJT), actual revenue CNY 1.435 B, actual EPS CNY 0.1937

Chipmore released FY2024 Q3 earnings on October 16 After-Market (BJT), actual revenue CNY 501.43 M, actual EPS CNY 0.0513

Chipmore to Release 2024 Q3 Earnings on October 17, 23:00 BJT

688347

01347

526050

On May 20th, the China Merchants CSI HK Connect Information Technology Composite ETF (526050) rose over 3% during the trading session, with constituent stocks SMIC and Hua Hong Semiconductor surging 11.53% and 14.24%, respectively. This increase was mainly catalyzed by the large-scale expansion cycle in storage, leading to a collective explosion in the semiconductor sector, with the ETF focusing on hard technology and highlighting its allocation value

同壁财经

Hua Hong

HUA HONG SEMI

China Merchants CSI HK Connect Information Technology Composite ETF

Hang Seng TECH Index

SMIC

LENOVO GROUP

XIAOMI-W

SENSETIME-W

SMIC HK SDR 5to1

LENOVO GROUP-R

Lenovo Group

Xiaomi Corporation

XIAOMI-WR

Xiaomi HK SDR 2to1

SENSETIME-WR

Punching the Hang Seng Tech and kicking the Chinese concept internet! The Hong Kong Stock Connect Information Technology (526050) rose over 3% during the session

688981

589190

Hwabao WP SSE STAR Chip ETF (589190) rose 1.5% in the morning session, with the latest price at 1.319 yuan and a turnover rate of 1.55%. SMIC rose over 4%, while stocks like Chipone and Cambricon performed well. The latest scale of the ETF reached 1.346 billion yuan, attracting 26.9095 million yuan in the past week, reflecting the overall performance of the STAR Market chip industry

Hwabao WP SSE STAR Chip ETF

STAR Chip Index

Piotech

Cambricon

VeriSilicon

AMEC

Biwin

Montage Technology

Hygon Information Technology

YUANJIE SEMICONDUCTOR

HWATSING

MONTAGE TECH

Reaching new highs again! Hwabao WP SSE STAR Chip ETF (589190) continued to rise by 1.5% in the morning session, and SMIC rose by over 4%

688352

688362

688372

688216

688403

603005

The integrated circuit packaging and testing sector surged, with Chipmore rising over 10%, followed by FHEC, V-Test, CHIPPACKING, UNION SEMICONDUCTOR (HEFEI), and WLCSP

Zhitong

FHEC

V-Test

CHIPPACKING

UNION SEMICONDUCTOR (HEFEI)

WLCSP

The integrated circuit packaging and testing sector surged sharply, with Chipmore rising over 10%

According to the Zhitong Finance APP, Chipmore announced that the Listing Review Committee of the Shanghai Stock Exchange held its 35th review meeting of 2025 on September 11, 2025 (referred to as the "meeting") to review the company's application for the issuance of convertible corporate bonds to unspecified objects. According to the results of the meeting, the company's application for the issuance of convertible corporate bonds to unspecified objects meets the issuance conditions, listing conditions, and information disclosure requirements

Chipmore's application for issuing convertible bonds has been approved by the Shanghai Stock Exchange

According to the announcement from Chipmore, the company will repurchase a portion of its issued ordinary shares (A shares) through centralized bidding. The amount for the repurchased shares will be no less than RMB 75 million (inclusive) and no more than RMB 150 million (inclusive). The repurchase price will not exceed RMB 16.61 per share (including tax), and the repurchase period will be within 12 months from the date the company's board of directors approves this repurchase plan

Chipmore plans to repurchase company shares for 75 million to 150 million yuan

688120

688186

On June 18th, 8 companies listed on the STAR Market disclosed their repurchase plans, most of which were proposed by the company's chairman, actual controllers, or general managers. Based on the proposed maximum repurchase amounts, GDTC, Chipmore, and HWATSING plan to repurchase amounts exceeding 100 million yuan

GDTC

Companies on the Sci-Tech Innovation Board are clustering to disclose repurchase plans

600584

With the booming development of edge AI applications, the demand for packaging testing will continue to rise. Taiwanese manufacturers are actively deepening their advanced packaging technology, and it is expected that by 2030, the global semiconductor market will grow to one trillion dollars, with the packaging market growing at a rate of over 10% annually, reaching a scale of 90 billion dollars by 2030. Despite geopolitical influences reshaping the global packaging and testing landscape, Taiwanese manufacturers still demonstrate industry advantages, accelerating capacity layout and consolidating their packaging advantages in high-end chips such as AI and GPU

- The global semiconductor industry is poised for significant growth, driven by rising demand for AI and high-performance computing, with projections indicating a market size of $1 trillion by 2030.  
- Taiwan's advanced packaging technology is expected to maintain its competitive edge in high-end chips, particularly in AI and GPUs, as the semiconductor packaging market is forecasted to grow over 10% annually, reaching $90 billion by 2030.  
- Companies like ASE Group are investing heavily in advanced packaging solutions, reflecting confidence in the sector's potential, especially in AI applications, which are anticipated to contribute significantly to revenue growth.

money.udn.com

JCET

Taiwan Semiconductor

New Hope

The advanced packaging in the semiconductor testing industry welcomes a great year, with strong orders for ASE, King Yuan Electronics, and Powertech

688720

002156

The United States is accelerating the advancement of advanced packaging technology, with the Department of Commerce announcing $1.4 billion in incentive funding to enhance its leadership in this field. The investment is seen as key to the success of the semiconductor industry, particularly in improving chip performance and reducing costs. The funds will be allocated to SK subsidiary Absolics, Applied Materials, and Arizona State University, focusing on advanced substrates and materials research to address the current bottlenecks in packaging technology

ASEM

TFME

DING LONG

Actionpower

Jilin OLED

KIBING

Valiant

HMZN

GRIPM

Milkyway

UNICOMP

YDME

Intel

NEWLIFE

Direxion Semicon Bull 3X

Grandit

Direxion Semicon Bear 3X

QIXIANG TENGDA

Datang Telecom

PERIC

InnoTek

Sunfar

Sinochem Equipment

Eontec

SUNWAY COMM

VITAL NEW MATERIAL

WG Tech

Shaanxi Lighte

VMAX

iShares Semiconductor ETF

Heyuan Gas

Semiconductor

Yongfu

Nonfemet

Motorola Solution

Applied Materials

ASML

JJKJ

Feinan Resources

HANBELL

Both

Ruking

FLAT GLASS

Samsung Electronics 

Great River Smart

FLAC

IFLYTEK

What does the U.S. see in the gamble on advanced packaging?

Chipmore (688352) stated in a recent institutional survey that the packaging technology for power management chips is transitioning to advanced packaging to meet the higher requirements for stability, power consumption, and size from end products such as consumer electronics. Currently, traditional packaging forms are mainly used, such as DIP, BGA, QFP/PFP, and SO

USHK News

Chipmore: Power management chip packaging technology is gradually advancing towards advanced packaging

OpenAI

Shanxi Securities research report pointed out that OpenAI has launched the Sora accelerated version, and AI large models are rapidly iterating under the push of tech giants, actively seeking commercialization landing scenarios. The demand for high-performance AI chips and servers will continue to grow, especially during the promotion phase of AI applications. It is recommended to pay attention to domestic equipment, materials, and components, as well as the demand for high-performance chips and advanced packaging driven by AI technology, which is expected to bring a wave of device replacement and hardware upgrade opportunities

HON-Flex

Huaqin

SHANXI SECURITIES

ByteDance

IEIT

Shanxi Securities: Focus on the wave of device upgrades and hardware upgrade opportunities brought by the first year of AI edge applications

Chipmore(688352.SH)