GlobalFoundries and TSMC sign $2B AI packaging deal
TechNode·
- GlobalFoundries and TSMC have signed a $2 billion, five-year manufacturing agreement to establish a US supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
- Under this pact, GlobalFoundries will expand capacity at its New York facility to supply interposers, with volume production expected to ramp in the first half of 2028.
- This partnership aims to strengthen the AI hardware supply chain by extending crucial advanced packaging capabilities to the United States while supporting growing computing demands.
