KLA

$KLA(KLAC.US)

I am holding KLAC while the market swings between AI optimism and short term semicap worries. The stock moves with foundry capex sentiment, but the business has not changed as much as the chart suggests.

KLAC sits in the inspection and metrology layer that every advanced node depends on. As chips become more complex, defect detection becomes more critical, creating a durable moat.

The market focuses on who builds the fastest chips, but I focus on who makes them possible. As computing reaches new limits, controlling imperfections becomes just as valuable as creating breakthroughs. KLAC may quietly become more important as technology advances.

@Captain's Treasure

Needham: WFE Spending

Nanya Technology plans to spend NT$200 billion (US$6.2 billion) on 2027 capex, up from this year’s NT$50B+, media report. Nanya is aiming for 30,000 wafers per month (wpm) capacity by 2028 at its new fab, which will ultimately reach 45Kwpm. Around NT$100B has already been spent on the total NT$480B fab project. Nanya is the biggest Taiwan DRAM maker. $Applied Materials(AMAT.US) $ASML(ASML.US) $Lam Research(LRCX.US) $KLA(KLAC.US)

Source: Dan Nystedt

$KLA(KLAC.US)

This week’s whipsaw shows short-term traders are just reacting to headlines. Bears panicked over memory supply chain rumors yesterday, then the stock bounced today after a strong analyst price target upgrade.

The bigger story is advanced packaging process control. As chip designs get more complex, KLA’s inspection and metrology leadership becomes more valuable.

I added shares today. A premier monopoly shouldn’t be treated like a trading vehicle, so I’m buying while the market argues over near-term targets.

@Bridge Buzz SG

$Lam Research(LRCX.US) $KLA(KLAC.US) $ASML(ASML.US) $TMC the Metals(TMC.US) - All of them look similar with exceptional candles.

Will it open high and close low again today, just to trick us? $KLA(KLAC.US)$Direxion Semicon Bull 3X(SOXL.US). On the other hand, in the US stock market, it feels like the focus of urgent value is shifting even more towards hardware.

$KLA(KLAC.US) | Cantor Fitzgerald maintains 𝐎𝐯𝐞𝐫𝐰𝐞𝐢𝐠𝐡𝐭 on 𝐊𝐋𝐀 𝐂𝐨𝐫𝐩𝐨𝐫𝐚𝐭𝐢𝐨𝐧, 𝐫𝐚𝐢𝐬𝐞𝐬 𝐏𝐓 𝐭𝐨 $𝟐,𝟎𝟎𝟎 𝐟𝐫𝐨𝐦 $𝟏,𝟔𝟎𝟎

The number of daily trading orders is very high today. Sold $Meta Platforms(META.US), further increasing exposure to AI. Part of the buying is for short-term rebound catching, and part is for building positions in $KLA(KLAC.US) and $Applied Materials(AMAT.US) as long-term holdings. If the rebound goes smoothly, subsequent short-term positions will continue to be moved into $VanEck Semiconductor ETF(SMH.US) for style distribution.

$KLA(KLAC.US)moving so slowly…

Nanya Technology expects 2026 capex to “surge past” the NT$52 billion guidance provided earlier as it continues to develop new products and production technologies, media report, including (products) 16Gb DDR5 validation, LPDDR5 pilot production, (production) 1c, 1d, 1e process advancement. $Micron Tech(MU.US) $SSNLF $HXSCL $Lam Research(LRCX.US) $KLA(KLAC.US) #semiconductors #semiconductor

Source: Dan Nystedt

Choose your semi. ⚔️

Daniel Loeb - Third Point Portfolio Updates

Winbond raised its capex to NT$49.41 billion (US$1.56 B), up NT$7.3 billion over the prior plan amid “incredibly tight” capacity due to ongoing memory chip shortages, with President PM Chen saying he’s spending more time with equipment vendors than customers these days to speed up expansion. Winbond’s revenue rose 43.7% in the first quarter to NT$38.3 billion, as capacity utilization rate neared 100%, gross margin climbed to 53.4% and net profit hit NT$10.12 billion. $HXSCL $SSNLF $Micron Tech(MU.US) $Applied Materials(AMAT.US) $KLA(KLAC.US) $Lam Research(LRCX.US) #Winbond #semiconductors

Source: Dan Nystedt

TSMC advanced packaging: A single CoWoS wafer now costs US$10,000 due to the shortage and high demand as it is vital to high-performance AI chips, media report. The high price means profits for TSMC because packaging equipment is far less expensive than fab equipment, meaning lower capex per-unit. TSMC’s 2026 capacity is seen at 1.3 million wafers (total), and 2.0M in 2027. Advanced packaging accounted for around 10% of TSMC’s 2025 revenue. $Taiwan Semiconductor(TSM.US) $BESI #Advantest #ASMI $Applied Materials(AMAT.US) $KLA(KLAC.US) #semiconductors

Source: Dan Nystedt

TSMC’s first sub-1nm fab will begin trial production in 2029 in Tainan, south Taiwan, DigiTimes reports. Fab A10’s pilot line will be for around 5,000 wafers-per-month (wpm). 1/3 $Taiwan Semiconductor(TSM.US) $ASML(ASML.US) $Tokyo Electron(TOELY.US) $Applied Materials(AMAT.US) $Lam Research(LRCX.US) $KLA(KLAC.US)

Source: Dan Nystedt

ASE, the chip packaging giant, expects to spend more than its original US$7 billion on capex this year due to strong AI demand, and announced an NT$108.3 billion (US$3.4B) plan to build a chip testing cluster in Kaohsiung, south Taiwan, media report, citing ASE COO Tien Wu, and adding ASE plans to break ground on Six new advanced packaging plants this year. ASE expects operations to begin at the Renwu, Kaohsiung site in April, 2027. The 2nd phase of expansion is set for October, 2027. $Advanced Semiconductor Engineering(ASX.US) $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) $BESI #Advantest $KLA(KLAC.US) $Teradyne(TER.US) #semiconductors

Source: Dan Nystedt

Tokyo Electron, Nikon remain vigilant over possible impact of DRAM shortages on SEMICONDUCTOR EQUIPMENT production, while Sony, Panasonic say procurement is under control and chip maker Renesas sees possible biz impact from high DRAM prices, Nikkei XTECH reports, adding Toyota, Honda, 5 more auto makers say no impact from DRAM shortage yet, and they are working closely with chip makers. $ASML(ASML.US) $Applied Materials(AMAT.US) $Lam Research(LRCX.US) $KLA(KLAC.US) $Tokyo Electron(TOELY.US) $Sony(SONY.US) $CAJ

Source: Dan Nystedt

ASE expects advanced semiconductor packaging revenue to reach US$3.2 billion this year, a revision from its prior forecast of $2.6B, and double last year’s $1.6B, media report, adding ASE said it will spend $7B on capex this year. The chip packaging giant held a groundbreaking ceremony Wednesday for a new NT$17.8B (US$570M) advanced plant in Kaohsiung (south), Taiwan’s Nanzih Industrial Park, its biggest domestic investment in 5-years. Construction will finish in the 2nd quarter 2028. $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) $Applied Materials(AMAT.US) $ASML(ASML.US) $BESI $Nova(NVMI.US) $KLA(KLAC.US)

Source: Dan Nystedt

Memory chip maker Winbond Electronics’ capacity is booked into 2027 and it will be cautious taking any orders that run over 3-months amid continued strong demand, media report, noting its February sales hit a record high for the 3rd straight month, up 91.2% year-on-year to NT$23.8 billion, despite fewer working days. Winbond plans to spend NT$42.1 billion (US$1.3 billion) on capex this year, up from NT$5.5 billion last year, to boost capacity. $Lam Research(LRCX.US) $KLA(KLAC.US) $Applied Materials(AMAT.US) $ASML(ASML.US) $Tokyo Electron(TOELY.US) #Winbond #Semiconductors

Source: Dan Nystedt