TSMC US SDR 300to1

UTSD

1.8001.10% ( -0.020 )

Delay Closed: Oct 16, 17:16:00

TSMC Stocks Fall Although $670 Target Raises the Advanced-Chip Stakes
GuruFocus·Oct 16, 2026 at 05:26 PM
- TSMC shares fell 1.73% to trade at $414.95 despite Barclays raising its price target to $670. - Advanced manufacturing processes, including 2-nanometer and 3-nanometer nodes, generated 41% of third-quarter wafer revenue. - Management forecasted fourth-quarter revenue between $52.3 billion and $54.3 billion, highlighting ongoing growth alongside expansion costs.
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Dolphin Daily | From Circuit Break to Rebound Overnight: Money Dumps AI hardware for Value — Dip Buy or Rotation?
Oct 16, 2026 at 01:41 AM
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TSMC Posts Surge in Q3 2026 Profit as Leading-Edge Chip Demand Ramps
Tip Ranks·Oct 15, 2026 at 10:59 AM
- TSMC reported a surge in its Q3 2026 financial results, posting a consolidated revenue of NT$ 1,494.24 billion and a diluted EPS of NT$ 29.43. - The strong financial performance was driven by robust demand for leading-edge nodes such as 2-nanometer, 3-nanometer, and 5-nanometer technologies. - Management expects continued momentum into the fourth quarter of 2026, projecting revenue between US$ 52.3 billion and US$ 54.3 billion.
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TSM: All Execution, No Hype — Can It Lead the Pack?
Oct 15, 2026 at 10:23 AM
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TSMC CEO sees no sign of a slowdown as chip foundry reports record profit
MarketWatch·Oct 15, 2026 at 08:42 AM
- Taiwan Semiconductor Manufacturing Co. reported a record third-quarter net profit of $23.87 billion, representing a 51% year-on-year increase driven by surging artificial-intelligence infrastructure demand. - CEO C.C. Wei stated there is no sign of a slowdown, with the company forecasting full-year 2026 dollar-term revenue growth of 44%. - TSMC expects fourth-quarter revenue between $52.3 billion and $54.3 billion and maintains its 2026 capital expenditure target at $60 billion to $64 billion.
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TSM Rev. improving, margins slightly pressured; AAPL China AI to launch in Dec. ｜Daily News Recap
Oct 15, 2026 at 08:37 AM
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TSM (Trans): Won't leave money on the table; aims to win every possible biz.
Oct 15, 2026 at 08:06 AM
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TSMC 3Q26 First Take: results were solid, but the market wants clarity on 2027 and beyond. With monthly ops data already disclosed, revenue came in at $46.7bn (+41% YoY), ahead of the $45.8bn consensus. On a TWD basis, revenue growth was 51% this quarter.Versus the pre-announced revenue, gross margin was the key focus. GPM was 66.4%, down 130bps QoQ and slightly below the Street at 66.8%. The pullback reflects the early drag from the 2nm ramp.The market expects 2027 ASP hikes: advanced nodes (≤7nm) up about 5–10%, and mature nodes (≥N7) low single digits. Combined with the 2nm ramp, GPM should resume an uptrend.With fabs running full, the company has stronger incentive to lift capex. It maintained 2026 capex at $60–64bn, unchanged from last quarter. This implies next-quarter capex of $19.3–23.4bn vs. $11.5bn a year ago, up 67–103% YoY.Investors are watching management’s forward capex outlook. The market now pencils in roughly $85bn for 2027, about +35% YoY.For next quarter, the company guides revenue of $52.3–54.3bn (above the $51.0bn Street) and GPM of 65–67% (Street at 66.8%). It raised its 2026 revenue growth outlook again to 44%, from slightly above 40% last quarter.Repeated revenue beats underscore solid operations. With 2026 largely in the bag, investors care more about the 2027 outlook. A clear guide for 40%+ full-year growth in 2027 would provide the confidence the market seeks.With the AI supply chain under pressure, the market is looking to TSMC to deliver a sufficiently explicit growth guide to lift sentiment. For more, follow Dolphin Research’s forthcoming takeaways and Trans. $Taiwan Semiconductor(TSM.US)
Oct 15, 2026 at 06:50 AM
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Red-hot CPI, Anthropic's ARR 'original sin', Xinyun funding at risk: Will AI bets get 'chopped' in a triple whammy?
Oct 15, 2026 at 01:41 AM
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ASML: Lithography tool capacity tightens. How soon before price hikes?
Oct 14, 2026 at 10:02 AM
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GOOGL's Gemini 4 Argon enters at a low price; ASML earnings steady but guidance cautious | Daily News Recap
Oct 14, 2026 at 08:31 AM
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ASML 3Q26 First Take: results were broadly in line, with revenue and GPM meeting prior guidance. Quarterly growth was driven by pull-ins from China customers and TSM, alongside rising demand for upgrade services.Beyond the reported figures, investors focused on guidance: the company raised its 2026 full-year outlook to €44–45bn (vs. €43–45bn last quarter). It only lifted the floor, not the ceiling, offering limited upside surprise.ASML typically provides next-year guidance in Q3, but it did not issue 2027 guidance this time. Watch the later earnings call for management’s view on 2027–2028; Dolphin Research will post updates promptly.Despite the broader AI-led market correction, ASML’s pullback has been relatively modest. Downstream foundry capex is clearly rising; for example, Micron guided FY2027 capex to over $50bn (+70% YoY). Beyond AI demand, High-NA EUV could usher in another product upgrade cycle. This would underpin sustained high growth for ASML.Overall, if management cannot articulate a clear 2027 outlook, the market may be disappointed near term. That said, given core fabs’ capex plans, downstream demand for semi equipment remains strong, and the company can still deliver high growth.$ASML(ASML.US) $ASML 2X Long ETF(ASMG.US) $Direxion Daily ASML Bull 2X ETF(ASMU.US)
Oct 14, 2026 at 07:11 AM
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Cerebras: Wafer-scale 'monster' chip—can it challenge NVDA?
Oct 9, 2026 at 09:22 AM
AAPL+0.43%TSM-2.28%
How the memory race ultimately ends comes down to one question: will AI be more constrained by capacity or by bandwidth? That single variable drives three scenarios.1) Capacity-bound: parameter counts stop exploding, and demand is driven by more users and longer context windows. Back-end memory, standard DDR, and HBF can fill the gap. Memory reverts to a commodity game focused on capacity and cost — but it is also the most 'cyclical', and once supply ramps, pricing comes under the most pressure.2) Bandwidth-bound: parameter counts keep climbing and speed requirements rise. The focus of competition shifts from 'stacking memory' to packaging and substrate/process technology, with bargaining power spilling over to foundries like TSMC. Memory vendors start to look more like 'die suppliers'.3) Both in short supply: the industry enters a memory 'super-cycle'. All paths are pursued in parallel, DRAM wafer and advanced packaging capacity both run tight. Memory makers carry the most weight in this setup.In practice, all three will likely coexist; the difference is which one dominates. Watch a few signals: the layer and stack counts of new HBM, realized speeds for HBM4E, the relative capacity ramp between CoWoS and DRAM wafers, and first-wave adoption of HBF.
Oct 9, 2026 at 02:04 AM
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$NVIDIA(NVDA.US) can raise memory capacity via two parallel paths: push process limits to make each stack denser, or avoid chasing per-stack density and win on unit count. While the industry races to stack HBM higher, Nvidia is taking the opposite route by cutting layer counts.First, the stacking route. HBM co-packages with the GPU under a shared lid, so total Z-height is capped (HBM4 relaxes it to 775 µm). To squeeze in more layers, dies must be thinned further and micro-bumps shrunk, or switched to Cu-Cu bonding, which raises process complexity, lowers yield, and complicates thermals.The upside is that each added layer benefits from first-rank bandwidth.Nvidia, however, is moving the other way. For the next-gen Rubin Ultra, HBM was initially specced at 16 layers, then cut to 12, and is now rumored to drop to 8.That would put per-stack capacity at roughly 192GB—below the current Rubin's 288GB—an unusual 'step back' for a flagship. These are not officially confirmed and only reflect options being weighed.Why cut layers? Capacity is the core constraint: the most advanced HBM4E is more complex, and suppliers cannot ramp to Nvidia's desired volume and cadence in the near term. At equal capacity, HBM already consumes ~3–4x the wafers of commodity DRAM, and higher stacks burn even more materials.More importantly, total system capacity can still go up via scale-up, linking more GPUs together. A B300 rack is around 20TB, and while Rubin Ultra's per-stack is smaller, interconnecting 576 GPUs can push system memory to ~110TB. In essence, cutting layers and shipping more stacks trades process difficulty and cost for volume under tight supply.This approach creates two new bottlenecks: first, the constraint shifts from memory makers' expansions to base-die and co-packaging capacity, i.e., how much capacity it can secure from TSMC. Second, it raises the bar for GPU interconnect and memory pooling.So whether to increase or decrease HBM layers hinges on two factors: whether bandwidth can keep up—stacking higher only helps if bandwidth scales—and whether packaging and base-die capacity is ample—if sufficient, cutting layers and using more stacks is viable.
Oct 9, 2026 at 02:02 AM
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